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工控主板可以在-20℃~60℃之間穩定、無故障的工作
2017-03-08 15:28:39 新聞來源:草莓視頻污片app:深圳市澤創偉業科技有限公司
工控(kong)主(zhu)板(ban),由于其設計用(yong)料(liao)的工業性,除支(zhi)持(chi)PCI插槽外,同時可(ke)以支(zhi)持(chi)MiniPCI-E、PC104+、COM口等接口,內嵌GPIO總(zong)線,可(ke)以實現GPI,GPO作用(yong),而且工業半(ban)長卡(ka)、全場卡(ka)能(neng)和底板(ban)配合(he)更具擴(kuo)展性支(zhi)持(chi)多個ISA、PCI、MINIPCI擴(kuo)展。
工(gong)(gong)(gong)(gong)(gong)控主(zhu)(zhu)板(ban)(ban)從設計,用料,生(sheng)產,制造都(dou)是經過嚴格的(de)(de)篩(shai)選和測試,保證(zheng)工(gong)(gong)(gong)(gong)(gong)控用戶正常、高可靠性的(de)(de)使用。同時也應(ying)該(gai)了(le)解為什么工(gong)(gong)(gong)(gong)(gong)業(ye)主(zhu)(zhu)板(ban)(ban)會比商用主(zhu)(zhu)板(ban)(ban)貴。雖然(ran)工(gong)(gong)(gong)(gong)(gong)業(ye)主(zhu)(zhu)板(ban)(ban)貴,但現(xian)在很多(duo)以前用開商用主(zhu)(zhu)板(ban)(ban)的(de)(de)客戶也開始改(gai)用工(gong)(gong)(gong)(gong)(gong)業(ye)主(zhu)(zhu)板(ban)(ban)了(le),因為對于一些工(gong)(gong)(gong)(gong)(gong)程項目來說,采用工(gong)(gong)(gong)(gong)(gong)業(ye)主(zhu)(zhu)板(ban)(ban)會使整(zheng)(zheng)個項目成本(ben)降(jiang)低。采用工(gong)(gong)(gong)(gong)(gong)業(ye)主(zhu)(zhu)板(ban)(ban)后(hou),減(jian)少了(le)后(hou)期的(de)(de)人工(gong)(gong)(gong)(gong)(gong)維(wei)護(hu)成本(ben)和使用成本(ben),而且(qie)(qie)提(ti)高了(le)系統的(de)(de)穩(wen)定性。而且(qie)(qie)隨著(zhu)主(zhu)(zhu)板(ban)(ban)元(yuan)器(qi)件(jian)的(de)(de)價格下(xia)降(jiang)工(gong)(gong)(gong)(gong)(gong)控主(zhu)(zhu)板(ban)(ban)和商用主(zhu)(zhu)板(ban)(ban)的(de)(de)價差拉近了(le)很多(duo),總的(de)(de)來看整(zheng)(zheng)體成本(ben)是降(jiang)低了(le)。
隨著工控(kong)主(zhu)板價格的(de)下(xia)降,一些(xie)對電腦作用(yong)要(yao)求單一但穩(wen)定性要(yao)求高(gao)的(de)場合,如多媒體廣告系統(tong)、證券交易系統(tong)等等很多都改用(yong)了工控(kong)(kong)主(zhu)板(ban),一些(xie)單片(pian)機應(ying)用(yong)的(de)機床(chuang)控(kong)(kong)制(zhi)也開始改用(yong)工控(kong)(kong)主(zhu)板(ban),因為(wei)工控(kong)(kong)主(zhu)板(ban)價格在用(yong)戶接受范圍,并能到達高(gao)穩(wen)定性,在X86架構下(xia)大大減輕(qing)了軟(ruan)件編(bian)程(cheng)難度,大大降低人(ren)工成(cheng)本。
工控(kong)主(zhu)板的應(ying)用面越(yue)來越(yue)廣,也證明了用戶對主(zhu)板品質要求的提(ti)高。
工作溫度和(he)散(san)熱(re):工控(kong)主(zhu)板可以(yi)在(zai)-20℃~60℃之間穩定、無故障的(de)工作,甚至某(mou)些(xie)工業主(zhu)板采(cai)用(yong)特(te)殊的(de)寬(kuan)溫設計,溫度范圍可達(da)-20度~70度。這對(dui)機構的(de)散(san)熱(re)方(fang)案,散(san)熱(re)效率都是一(yi)個嚴峻的(de)考驗。在(zai)工控(kong)主(zhu)板機構的(de)散(san)熱(re)設計上(shang),必(bi)須使用(yong)全鋁制的(de)機構外殼和(he)特(te)殊的(de)散(san)熱(re)設計,而且對(dui)CPU、南北(bei)橋和(he)硬盤等發熱(re)大戶,進行(xing)特(te)殊處理,保證工控(kong)主(zhu)板和(he)整機的(de)正(zheng)常運行(xing)。